Thursday, March 2, 2017

GaN Systems releases power HEMT thermal models

To support customers who are modelling power systems with its gallium nitride transistors, using SPICE simulations, GaN Systems has released individual computer models of its products, as well as application note GN007, ‘Modeling thermal behavior of GaN Systems’ GaNPX using RC thermal SPICE model‘. GaNPX is GaN Systes’ proprietary low-profile package, designed with low inductance ...

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