Monday, July 3, 2017

Hynix ramping 72-layer 3D NAND

Hynix has started to ramp volume production of its 72-layer 3D NAND memory, according to the Korea IT Times. The 256Gbit TLC chips chips are being used to deliver a 1Tbit SSD which uses Hynix’ own controller chip.. The chips are currently being made in Hynix’ Cheongju fab but it plans to add production from ...

This story continues at Hynix ramping 72-layer 3D NAND

Or just read more coverage at Electronics Weekly

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