Leti, an institute of CEA Tech, has announced the world’s first successful 300mm wafer-to-wafer direct hybrid bonding with pitch dimension connections as small as 1µm and copper pads as small as 500nm. This was achieved in partnership with EV Group, a supplier of wafer bonding and lithography equipment. “To our knowledge, this is the first ...
This story continues at Leti claims 3D chip breakthrough on 300mm wafers
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