Tuesday, July 10, 2018

Shottky for back-flow protection leaks and heats less

Toshiba has launched a Schottky barrier diode aimed at rectification and back-flow prevention. Called CUHS10F60, due to the newly developed 2.5 x 1.4mm US2H package (SOD-323HE) it features a thermal resistance of 105°C/W. “The package’s thermal resistance has been reduced by about 50% compared to the conventional USC package,” said the firm. In comparison to Toshiba’s earlier ...

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Or just read more coverage at Electronics Weekly

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