At VLSI 2018, Samsung unveiled its forthcoming 7nm FinFET platform technology, said to be the first mainstream semiconductor manufacturing technology to use extreme ultraviolet (EUV) lithography for single-patterning of middle- and back-end-of-the line features – EUV is expected to offer better pattern uniformity and cost advantages versus standard multiple-patterning approaches for extreme scaling. by Gary ...
This story continues at VLSI Symposia: Samsung eyes EUV for mainstream chip-making at 7nm
Or just read more coverage at Electronics Weekly
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