Intel debuts Foveros

Intel has cone up with a packaging technology called  ‘Foveros’. Foveros ‘paves the way for devices and systems combining high-performance, high-density and low-power silicon process technologies,’ says Intel, ‘Foveros is expected to extend die stacking beyond traditional passive interposers and stacked memory to high-performance logic, such as CPU, graphics and AI processors.’ Intel adds that ...

This story continues at Intel debuts Foveros

Or just read more coverage at Electronics Weekly