Leti, the French semiconductor research institute, has teamed with Berlin-based Fraunhofer’s microelectronics group, to extend next generation CMOS technologies for Internet of Things, augmented reality, automotive, health and aeronautics. The will support the development of FDSOI – fully depleted silicon on insulator – advanced semiconductor process technology in Europe. “The ability to, one, develop key ...
Read full article: French and German researchers collaborate on future chip technologies
No comments:
Post a Comment