Monday, November 27, 2017

Coil on Module for secure wireless payments

Infineon is expanding its CoM (Coil on Module) portfolio for secure contactless ID documents. The new SLC52 security chip is now available, integrated with the card antenna into a polycarbonate monoblock inlay. Conventional chip packages are welded, soldered or glued to the card antenna. With the CoM package, however, the chip module communicates with the ...

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