Monday, December 17, 2018

Polymeric materials advance in packaging

The polymeric materials market revenue will double over the next five years, says Yole Développement, driven by miniaturisation and higher functionalities in applications like AI, 5G, and AR/VR requiring packaging including high-density FOWLP, 3D stacked TSV, WLCSP and flip-chip.    “The innovative advanced packaging platforms have reached a new level of complexity and now demand higher ...

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