ADI creates internal silicon PCB for system-in-package ADCs

To increase system-in-package integration density, Analog Devices is stacking die on a passives-on-silicon substrate using technology developed at its Limerick design centre. Dubbed iPassive, “this is a new thing in system-in-package”, ADI field application engineer Thomas Tzscheetzsch told Electronics Weekly at Embedded World in Nuremberg. “The passives are in the silicon, not in poly, real ...

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