Wednesday, March 13, 2019

HiSilicon closing on Qualcomm

HiSilicon, Huawei’s chip arm, is closing in on  Qualcomm’s leadership in mobile IC technology. The immediate win targeted by HiSilicon is in 5G modem design and its next target is to get an advantage in process by being first to  have chips made on the EUV version of TSMC’s 7nm process. “Our 5G modem can download ...

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Or just read more coverage at Electronics Weekly

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